General Partner description:

TAIPRO Engineering’s target market is the tailored microsystems (smart sensors). Its goal is to give a high-level support to identify and respond to needs of industrialists. TAIPRO Engineering focuses its activities on innovative assembly (packaging) of existing sensors and microelectronic COTS (Components off the Shelf) to perform customized solutions with new functionalities for industrial applications. TAIPRO Engineering’s skills are full development project based on a functional and/or technical specification and packaging design, support, prototyping and production (industrialization) for front-end and back-end sectors.

 Key personnel:

Michel Saint-Mard, Mechanical Engineer from the University of Liege, Professional experience: Three years research engineer at the Royal Military Academy, 8 years project manager for cryogenic space valve development, 4 years Responsible of the MICROSYS Laboratory (microelectronic packaging laboratory) of the University of Liege. Since February 2009, managing director of TAIPRO Engineering.

Bruno Heusdens

• June 2000: Graduated as an electronic engineer from the University of Liège in Belgium.
• After a short stint at Proximus, I returned in February 2001 to the University of Liège as a researcher in the Microelectronics department. I worked on microfluidics projects applied to biotechnology, particularly DNA sequencing.
• In 2006, I joined the Microsys project to create a microelectronics assembly and packaging laboratory with 2 colleagues. I worked on several microsystem projects applied to industry, such as intelligent lubrication and predictive maintenance in aeronautics. With the creation of Taipro in 2009, I took over the laboratory. In April 2011, I joined my 2 colleagues at Taipro, where I became responsible for production and an expert in microelectronic packaging.
• I currently manage the production team as well as several European-funded projects for RF chip packaging, like SWARTWAY and PLASNANO

Adrien Hertay

• I completed my undergraduate studies with a bachelor’s degree in automation in 2020, and subsequently delved into advanced studies in electronics. In 2023, I achieved success in obtaining my master’s degree in electronics, concentrating on embedded systems.
• From September onwards, I have been employed at Taipro Engineering, holding the position of Research Engineer with a specialization in microsystems. Beyond my professional endeavors, my passion for music takes center stage as I actively involve myself in playing. This pursuit significantly enhances my creativity and determination, complementing my work in a meaningful way.

Significant infrastructure and any major items of technical equipment:

To develop its activities, TAIPRO Engineering has an access to a facility which includes specific equipment dedicated to packaging operations located in a 200 m2 certified clean room (ISO 7 – class 10000). With this equipment, TAIPRO Engineering is able to assemble, interconnect, encapsulate and characterize a wide range of microsystems.

Capabilities of the facility:

• Plasma cleaning,
• Automatic pick and place (die attach, SMD and bare die pick & place, flip chip),
• Automatic ultrasonic wire bonding,
• Curing oven (Vacuum, Nitrogen, air),
• Encapsulation: Microsystems protection (potting, globe top, dam and fill, hermetic seam sealing),
• Tests (Wire pull test, Ball & die shear test, Gross leak detector, Fine leak, Electrical measurements)
• Hermetic seam sealing
• Laser marking
• Laser trimming